EconomyJapan’s Sumitomo Bakelite to expand China chip-packaging materials output amid AI boom
Sumitomo Bakelite plans to boost production of advanced chip-packaging materials in China and Singapore, its second announcement involving Chinese operations in less than four months. The Japanese company said it will add lines for mould underfill materials and compression-moulding granules at its Suzhou facilities as AI lifts demand for more sophisticated semiconductors.
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South China Morning Post★★☆☆☆2026-10-11 03:04Original
Japan’s Sumitomo Bakelite to expand China chip-packaging materials output amid AI boom
Economy